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本期内容
2020年2/3月刊
封面故事 Cover Story
步进式光刻机简化5G市场的 pHEMT 生产
Stepper streamlines pHEMT production for 5G markets
Barry Lin, Chao-Min Chang, Cliff Yang; WAVETEK微电子公司
编者话 Editorial
Yole预测外延设备市场将发生巨大变化
Yole Forecasts Big Changes In Epitaxy equipment Market
赵雪芹
业界动态 Industry
Soitec开发创新型衬底InGaNOS
Soitec develops innovative InGaNOS substrates
Ouster推出低成本高分辨率 32通道激光雷达传感器
Ouster announced a low-cost and high-resolution 32-channel LIDAR sensor
欧司朗新型近距红外激光助力自动驾驶
Osram's new short-range infrared laser assisted autonomous vehicles
吴越半导体氮化镓项目落户无锡先导产业园
GOETSU SEMICONDUCTOR GaN project settled in Wuxi Lead Industry Park
台积电与意法半导体合作开发氮化镓
TSMC and STMicroelectronics cooperate on GaN
汽车市场将推动SiC和GaN的进一步增长
Automotive market will drive further growth in SiC and GaN
宽禁带半导体国家工程研究中心专栏 WBS Column
科技前沿 Research Review
技术 Technology
彩色的芯片级microLED显示
Colourful chip-scale microLED displays
Hoi Wai Choi, Wai Yuen Fu, Hao Lyu, 香港大学
新型热原子层刻蚀技术制造创纪录性能的极小型InGaAs FinFET
Novel thermal atomic layer etching technique yields incredibly small InGaAs FinFETs with record-breaking performance
Wenjie Lu, Younghee Lee, Jesús Del Alamo, Steven George; 麻省理工学院和科罗拉多大学博尔德分校
非接触电计量: 
削减成本和缩短时间
Non-contact electrical metrology: trimming costs and slashing time
Marshall Wilson, SEMILAB SDI
平衡电荷以提升性能
Balancing charges to boost performance
Alexander Bolotnikov, Reza Ghandi, Peter Losee, Sacey Kennerly, Ravisekhar Rajtu; 通用电气公司
九峰山实验室专栏 JFS Laboratory Column
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